Solder Joint Reliability Assessment: Finite Element Simulation Methodology by No
125,41 €
Application I: Solder Joint Reflow Process. - Fatigue Fracture Process of Solder Joints. Back Cover. by Norhashimah M. Shaffiar, Mohd N. Tamin. Publication Date 2016-09-03. Illustrations 55 Illustrations, color; 64 Illustrations, black and white; XIII, 174 p. 119 illus., 55 illus.
Jetzt bei Ebay:
