More-than-Moore 2.5D and 3D SiP Integration by Riko Radojcic (English) Paperback
98,74 €
Radojcic has more than thirty year's experience in the semiconductor industry, and has specialized in integration of process technology and design considerations. Radojcic has held a series of managerial and engineering positions with Unisys and Burroughs, in device engineering, failure analyses and reliability engineering areas.
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