Modellierung und Simulation für mikroelektronische Verpackungsbaugruppe: Fertigung, R
165,40 €
In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. He obtained a Ph.D. from Stanford in 1992, and got MS and BS in flight vehicle design, Nanjing University of Aeronautics and Astronautics, and he had three years industrial experience in China and USA.
Jetzt bei Ebay:
![Produktbild - Ductile Fracture in Metal Forming: Modeling and Simulation [Paperback]](https://i.ebayimg.com/thumbs/images/g/QIcAAOSwIS1nl8Rl/s-l140.jpg)
