Introduction to Microsystem Packaging Technology, Hardcover by Jin, Yufeng; W...

Introduction to Microsystem Packaging Technology, Hardcover by Jin, Yufeng; Wang, Zhiping; Chen, Jing, ISBN 1439819106, ISBN-13 9781439819104, Brand New, Free shipping in the US Distributed in the . by CRC Press, this is the second edition of a textbook published by Science Press (Beijing), and probably most appropriate for upper level undergraduate or early graduate students. The focus is broad, covering packaging of microelectronics, as well as radio frequency (RF), wireless, and optical systems. Packaging of micro-electro-mechanical systems (MEMS) receives its own chapter. Although English is not the authors' original language, the sentences are clear and th is well organized. Includes questions at the end of each chapter. Annotation ©2010 Book News, Inc., Portland, OR ()

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