Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced A
128,50 €
Steffen Kröhnert is President & Founder of ESPAT-Consulting in Dresden, Germany. Steffen has over 20 years' experience in the semiconductor industry and is the author or co-author of 23 patent filings.
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![Produktbild - Fan-Out Wafer-Level Packaging by Lau, John H. [Hardback]](https://i.ebayimg.com/thumbs/images/g/Xe4AAeSwazNoMamC/s-l140.jpg)
