Vermeidung unelastischer Dehnungen in Lötstellenverbindungen von IC-Geräten, Pa...
108,72 €
Avoiding Inelastic Strains in Solder Joint Interconnections of Ic Devices, Paperback by Suhir, Ephraim, ISBN 0367635887, ISBN-13 9780367635886, Brand New, Free P&P in the UK Th addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.
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