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Arbitrary Modeling of TSVs for 3D Integrated Circuits by Khaled Salah (English)

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This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.

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ISBN-13:

9783319374970
Book Title:

Arbitrary Modeling of TSVs for 3D Integrated Circuits
ISBN:

9783319374970

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