3D Stacked Chips: From Emerging Processes to Heterogeneous Systems by Ibrahim M.
65,87 €
Provides single-source reference to the latest research in 3D optoelectronic integration: process, devices, and systems; Explains the use of wireless 3D integration to improve 3D IC reliability and yield; Describes techniques for monitoring and mitigating thermal behavior in 3D ICs; Includes discussion of 3D integration of high-density power sources and novel NVM.
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